Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6727593 | Semiconductor device with improved bonding | Hiroshi Toyoda, Mitsuhiro Nakao, Masahiko Hasunuma, Hisashi Kaneko, Toshiaki Komukai | 2004-04-27 |
| 6673704 | Semiconductor device and method of manufacturing the same | Junichi Wada, Tomio Katata, Takamasa Usui, Masahiko Hasunuma, Hideki Shibata +3 more | 2004-01-06 |