Issued Patents 2004
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6835631 | Method to enhance inductor Q factor by forming air gaps below inductors | Zheng Zhen, Sanford Chu, Ng Chit Hwei, Purakh Raj Verma | 2004-12-28 |
| 6777329 | Method to form C54 TiSi2 for IC device fabrication | Shaoyin Chen, Ze Shen, Alex See | 2004-08-17 |
| 6747314 | Method to form a self-aligned CMOS inverter using vertical device integration | Ravi Sundaresan, Yang Pan, James Yong Meng Lee, Ying-Keung Leung, Yelehanka Ramachandramurthy +2 more | 2004-06-08 |
| 6730571 | Method to form a cross network of air gaps within IMD layer | Cher Liang Cha, Kheng Chok Tee | 2004-05-04 |
| 6716693 | Method of forming a surface coating layer within an opening within a body by atomic layer deposition | Sanford Chu, Chit Hwei Ng, Yelehanka Ramachandramurthy Pradeep, Jia Zhen Zheng | 2004-04-06 |
| 6709934 | Method for forming variable-K gate dielectric | James Yong Meng Lee, Ying-Keung Leung, Yelehanka Ramachandramurthy Pradeep, Jia Zhen Zheng, Elgin Quek +2 more | 2004-03-23 |
| 6696761 | Method to encapsulate copper plug for interconnect metallization | Sam Fong Yau Li, Hou T. Ng | 2004-02-24 |
| 6680239 | Effective isolation with high aspect ratio shallow trench isolation and oxygen or field implant | Cher Liang Cha, Kok Keng Ong, Alex See | 2004-01-20 |