Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6696761 | Method to encapsulate copper plug for interconnect metallization | Lap Chan, Sam Fong Yau Li | 2004-02-24 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6696761 | Method to encapsulate copper plug for interconnect metallization | Lap Chan, Sam Fong Yau Li | 2004-02-24 |