Issued Patents 2004
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6785137 | Method and system for removing heat from an active area of an integrated circuit device | — | 2004-08-31 |
| 6769174 | Leadframeless package structure and method | Anthony M. Chiu | 2004-08-03 |
| 6771500 | System and method for direct convective cooling of an exposed integrated circuit die surface | Anthony M. Chiu | 2004-08-03 |
| 6762470 | Fingerprint sensor having a portion of the fluorocarbon polymer physical interface layer amorphized | Fred Lane | 2004-07-13 |
| 6759326 | Method of making a semiconductor device having a planarized fluoropolymer passivating layer with selectively implanted charged particles | Fred Lane | 2004-07-06 |
| 6707093 | Selective ionic implantation of fluoropolymer film to modify the sensitivity of underlying sensing capacitors | Fred Lane, Richard P. Evans | 2004-03-16 |
| 6700190 | Integrated circuit device with exposed upper and lower die surfaces | Anthony M. Chiu | 2004-03-02 |
| 6693441 | Capacitive fingerprint sensor with protective coating containing a conductive suspension | Fred Lane, Giovanni Gozzini | 2004-02-17 |