Issued Patents 2004
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6818963 | Surface mount package for linear array sensors | — | 2004-11-16 |
| 6787388 | Surface mount package with integral electro-static charge dissipating ring using lead frame as ESD device | — | 2004-09-07 |
| 6769174 | Leadframeless package structure and method | Harry Michael Siegel | 2004-08-03 |
| 6771500 | System and method for direct convective cooling of an exposed integrated circuit die surface | Harry Michael Siegel | 2004-08-03 |
| 6707163 | Method of eliminating uncontrolled voids in sheet adhesive layer | — | 2004-03-16 |
| 6700190 | Integrated circuit device with exposed upper and lower die surfaces | Harry Michael Siegel | 2004-03-02 |
| 6686546 | Static charge dissipation for an active circuit surface | — | 2004-02-03 |