Issued Patents 2004
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6825117 | High PH slurry for chemical mechanical polishing of copper | A. Feller, Kenneth Cadien | 2004-11-30 |
| 6787061 | Copper polish slurry for reduced interlayer dielectric erosion and method of using same | — | 2004-09-07 |
| 6752844 | Ceric-ion slurry for use in chemical-mechanical polishing | A. Feller, Kenneth Cadien | 2004-06-22 |
| 6740591 | Slurry and method for chemical mechanical polishing of copper | A. Feller, Kenneth Cadien | 2004-05-25 |
| 6719614 | Method and chemistry for cleaning of oxidized copper during chemical mechanical polishing | A. Feller, Kenneth Cadien | 2004-04-13 |
| 6719920 | Slurry for polishing a barrier layer | — | 2004-04-13 |