Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6830990 | Method and apparatus for dicing released MEMS wafers | Kenneth Honer, Aaron Parker | 2004-12-14 |
| 6822318 | Stress isolating die attach structure and method | Kenneth Honer | 2004-11-23 |