Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6835117 | Endpoint detection in chemical-mechanical polishing of patterned wafers having a low pattern density | Leping Li, Yingru Gu, Hung-Chin Guthrie | 2004-12-28 |
| 6741913 | Technique for noise reduction in a torque-based chemical-mechanical polishing endpoint detection system | Yingru Gu, Leping Li | 2004-05-25 |