Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6832747 | Hybrid molds for molten solder screening process | Steven A. Cordes, David Danovitch, James L. Speidell, Joseph Zinter | 2004-12-21 |
| 6708872 | Method and apparatus for applying solder to an element on a substrate | Chon Cheong Lei | 2004-03-23 |
| 6708873 | Apparatus and method for filling high aspect ratio via holes in electronic substrates | Frederic Maurer, Lubomyr T. Romankiw | 2004-03-23 |