LR

Lubomyr T. Romankiw

IBM: 1 patents #1,866 of 5,464Top 35%
📍 Briarcliff Manor, NY: #16 of 31 inventorsTop 55%
🗺 New York: #2,888 of 9,035 inventorsTop 35%
Overall (2004): #166,774 of 270,089Top 65%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6708873 Apparatus and method for filling high aspect ratio via holes in electronic substrates Peter A. Gruber, Frederic Maurer 2004-03-23