Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6675456 | Alignment plate with matched thermal coefficient of expansion method | — | 2004-01-13 |
| 6673190 | Lasable bond-ply materials for high density printed wiring boards | David Haas, Chengzeng Xu, Mavyn McAuliffe, Scott M. Zimmerman, Laura Miller +2 more | 2004-01-06 |