Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6673190 | Lasable bond-ply materials for high density printed wiring boards | Chengzeng Xu, Mavyn McAuliffe, Scott M. Zimmerman, Laura Miller, Meifang Qin +2 more | 2004-01-06 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6673190 | Lasable bond-ply materials for high density printed wiring boards | Chengzeng Xu, Mavyn McAuliffe, Scott M. Zimmerman, Laura Miller, Meifang Qin +2 more | 2004-01-06 |