Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6812131 | Use of sacrificial inorganic dielectrics for dual damascene processes utilizing organic intermetal dielectrics | Joseph Kennedy, Henry Chung | 2004-11-02 |
| 6806168 | Healing of micro-cracks in an on-chip dielectric | Steven Towle | 2004-10-19 |
| 6780517 | Polycarbosilane adhesion promoters for low dielectric constant polymeric materials | Tian-An Chen, Kreistler S. Y. Lau, Hui-Jung Wu | 2004-08-24 |
| 6761975 | Polycarbosilane adhesion promoters for low dielectric constant polymeric materials | Tian-An Chen, Kreistler S. Y. Lau, Hui-Jung Wu | 2004-07-13 |