Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6821878 | Area-array device assembly with pre-applied underfill layers on printed wiring board | Janice Danvir | 2004-11-23 |
| 6774497 | Flip-chip assembly with thin underfill and thick solder mask | Janice Danvir, Tomasz L. Klosowiak, Prasanna Kulkarni, Nadia Yala | 2004-08-10 |