Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6774497 | Flip-chip assembly with thin underfill and thick solder mask | Jing Qi, Janice Danvir, Tomasz L. Klosowiak, Nadia Yala | 2004-08-10 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6774497 | Flip-chip assembly with thin underfill and thick solder mask | Jing Qi, Janice Danvir, Tomasz L. Klosowiak, Nadia Yala | 2004-08-10 |