Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6764945 | Method of manufacturing a multilayer metallization structure with non-directional sputtering method | Tatsuyuki Saito, Uitsu Tanaka, Hidenori Suzuki, Hideaki Tsugane, Yasuko Yoshida +1 more | 2004-07-20 |
| 6696357 | Method for manufacturing semiconductor integrated circuit devices using a conductive layer to prevent peeling between a bonding pad and an underlying insulating film | Toshinori Imai, Tsuyoshi Fujiwara, Tomohiro Shiraishi, Masaaki Yoshida | 2004-02-24 |