Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6696357 | Method for manufacturing semiconductor integrated circuit devices using a conductive layer to prevent peeling between a bonding pad and an underlying insulating film | Toshinori Imai, Tsuyoshi Fujiwara, Hiroshi Ashihara, Masaaki Yoshida | 2004-02-24 |