Issued Patents 2004
Showing 1–4 of 4 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6800932 | Package for semiconductor die containing symmetrical lead and heat sink | Richard K. Williams, Alex K. Choi | 2004-10-05 |
| D488136 | Portion of a matrix for surface mount package leadframe | James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing | 2004-04-06 |
| D487431 | Portion of a matrix for surface mount package leadframe | James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing | 2004-03-09 |
| D485808 | Portion of a matrix for surface mount package leadframe | James Harnden, Richard K. Williams, Anthony Chia, Chu Weibing | 2004-01-27 |