Issued Patents 2004
Showing 1–15 of 15 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6800932 | Package for semiconductor die containing symmetrical lead and heat sink | Allen K. Lam, Alex K. Choi | 2004-10-05 |
| D494939 | Portion of a matrix for surface mount package leadframe | James Harnden, Anthony Chia, Chu Weibing | 2004-08-24 |
| D492266 | Portion of a matrix for surface mount package leadframe | James Harnden, Anthony Chia, Chu Weibing | 2004-06-29 |
| 6756274 | Fabrication process for a super-self-aligned trench-gated DMOS with reduced on-resistance | Wayne B. Grabowski | 2004-06-29 |
| D491900 | Portion of a matrix for surface mount package leadframe | James Harnden, Anthony Chia, Chu Weibing | 2004-06-22 |
| 6750507 | Super-self-aligned trench-gated DMOS with reduced on-resistance | Wayne B. Grabowski | 2004-06-15 |
| D488136 | Portion of a matrix for surface mount package leadframe | James Harnden, Anthony Chia, Chu Weibing, Allen K. Lam | 2004-04-06 |
| D487432 | Portion of a matrix for surface mount package leadframe | James Harnden, Anthony Chia, Chu Weibing | 2004-03-09 |
| D487431 | Portion of a matrix for surface mount package leadframe | James Harnden, Anthony Chia, Chu Weibing, Allen K. Lam | 2004-03-09 |
| D486802 | Portion of a matrix for surface mount package leadframe | James Harnden, Anthony Chia, Chu Weibing | 2004-02-17 |
| D485808 | Portion of a matrix for surface mount package leadframe | James Harnden, Anthony Chia, Chu Weibing, Allen K. Lam | 2004-01-27 |
| D485244 | Portion of a matrix for surface mount package leadframe | James Harnden, Anthony Chia, Chu Weibing | 2004-01-13 |
| D485243 | Portion of a matrix for surface mount package leadframe | James Harnden, Anthony Chia, Chu Weibing | 2004-01-13 |
| D484858 | Portion of a matrix for surface mount package leadframe | James Harnden, Anthony Chia, Chu Weibing | 2004-01-06 |
| D484859 | Portion of a matrix for surface mount package leadframe | James Harnden, Anthony Chia, Chu Weibing | 2004-01-06 |