Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6693029 | Method of forming an insulative substrate having conductive filled vias | Makoto Iijima, Seiji Ueno, Muneharu Morioka | 2004-02-17 |
MN
Masaru Nukiwa
Overall (2004): #160,272 of 270,089Top 60%
1
Patents 2004