Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6693029 | Method of forming an insulative substrate having conductive filled vias | Masaru Nukiwa, Seiji Ueno, Muneharu Morioka | 2004-02-17 |
MI
Makoto Iijima
Overall (2004): #163,135 of 270,089Top 65%
1
Patents 2004