Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6767437 | Electroplating apparatus and electroplating method | Tetsuo Matsuda, Hisashi Kaneko, Koji Mishima, Junji Kunisawa | 2004-07-27 |
| 6746589 | Plating method and plating apparatus | Koji Mishima, Hiroaki Inoue, Junji Kunisawa, Kenji Nakamura, Tetsuo Matsuda +2 more | 2004-06-08 |
| 6689257 | Substrate processing apparatus and substrate plating apparatus | Koji Mishima, Junji Kunisawa, Norio Kimura, Hiroaki Inoue, Kenji Nakamura +3 more | 2004-02-10 |