Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6812576 | Fanned out interconnect via structure for electronic package substrates | Siamak Fazelpour | 2004-11-02 |
| 6713853 | Electronic package with offset reference plane cutout | Siamak Fazelpour, Michel Fleury | 2004-03-30 |