Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6740580 | Method to form copper interconnects by adding an aluminum layer to the copper diffusion barrier | Subhash Gupta, Mei Sheng Zhou | 2004-05-25 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6740580 | Method to form copper interconnects by adding an aluminum layer to the copper diffusion barrier | Subhash Gupta, Mei Sheng Zhou | 2004-05-25 |