Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6762509 | Flip-chip packaging method that treats an interconnect substrate to control stress created at edges of fill material | Sabran B. Samsuri | 2004-07-13 |
| 6737752 | Flip-chip package containing a chip and a substrate having differing pitches for electrical connections | — | 2004-05-18 |
| 6699732 | Pitch compensation in flip-chip packaging | — | 2004-03-02 |