Issued Patents 2004
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6762509 | Flip-chip packaging method that treats an interconnect substrate to control stress created at edges of fill material | Robert M. Hilton | 2004-07-13 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6762509 | Flip-chip packaging method that treats an interconnect substrate to control stress created at edges of fill material | Robert M. Hilton | 2004-07-13 |