Issued Patents 2004
Showing 1–9 of 9 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6809414 | Semiconductor chip assembly with bumped conductive trace | Charles W. C. Lin | 2004-10-26 |
| 6803651 | Optoelectronic semiconductor package device | — | 2004-10-12 |
| 6800506 | Method of making a bumped terminal in a laminated structure for a semiconductor chip assembly | Charles W. C. Lin | 2004-10-05 |
| 6794741 | Three-dimensional stacked semiconductor package with pillars in pillar cavities | Charles W. C. Lin, David M. Sigmond | 2004-09-21 |
| 6774659 | Method of testing a semiconductor package device | — | 2004-08-10 |
| 6744126 | Multichip semiconductor package device | — | 2004-06-01 |
| 6740576 | Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assembly | Charles W. C. Lin | 2004-05-25 |
| 6716670 | Method of forming a three-dimensional stacked semiconductor package device | — | 2004-04-06 |
| 6699780 | Method of connecting a conductive trace to a semiconductor chip using plasma undercut etching | Charles W. C. Lin | 2004-03-02 |