Issued Patents 2004
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6809414 | Semiconductor chip assembly with bumped conductive trace | Cheng-Lien Chiang | 2004-10-26 |
| 6800506 | Method of making a bumped terminal in a laminated structure for a semiconductor chip assembly | Cheng-Lien Chiang | 2004-10-05 |
| 6794741 | Three-dimensional stacked semiconductor package with pillars in pillar cavities | Cheng-Lien Chiang, David M. Sigmond | 2004-09-21 |
| 6765287 | Three-dimensional stacked semiconductor package | — | 2004-07-20 |
| 6765264 | Method of fabricating power rectifier device to vary operating parameters and resulting device | Paul Chang, Geeng-Chuan Chern, Wayne Y. W. Hsueh, Vladimir Rodov | 2004-07-20 |
| 6740576 | Method of making a contact terminal with a plated metal peripheral sidewall portion for a semiconductor chip assembly | Cheng-Lien Chiang | 2004-05-25 |
| 6699780 | Method of connecting a conductive trace to a semiconductor chip using plasma undercut etching | Cheng-Lien Chiang | 2004-03-02 |
| 6673710 | Method of connecting a conductive trace and an insulative base to a semiconductor chip | — | 2004-01-06 |