Issued Patents 2004
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6794623 | Guided heating apparatus and method for using the same | Bob Sankman | 2004-09-21 |
| 6794761 | No-flow underfill material | Tian-An Chen | 2004-09-21 |
| 6746896 | Process and material for low-cost flip-chip solder interconnect structures | Ching-Ping Wong | 2004-06-08 |
| 6730542 | Polybenzoxazine based wafer-level underfill material | Lejun Wang, Tian-An Chen | 2004-05-04 |
| 6727594 | Polybenzoxazine based wafer-level underfill material | Lejun Wang, Tian-An Chen | 2004-04-27 |
| 6703299 | Underfill process for flip-chip device | Milan Djukic | 2004-03-09 |