Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6746896 | Process and material for low-cost flip-chip solder interconnect structures | Song Shi | 2004-06-08 |
| 6740192 | Joining electroconductive materials with electroconductive adhesive containing epoxide-modified polyurethane | Daoqiang Lu | 2004-05-25 |