Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6709252 | Molding apparatus | Jie Liu, Shu Chuen Ho, Man Ho Hui, Teng Hock Kuah | 2004-03-23 |
| 6674165 | Mold for a semiconductor chip | Shu Chuen Ho, Teng Hock Kuah, Srikanth Narasimulau, Charles Vath | 2004-01-06 |