Issued Patents 2004
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6808661 | Method for encapsulating leadframe-mounted integrated circuits | See Yap Ong, Kock Wee, Teng Hock Kuah, Jian Wu | 2004-10-26 |
| 6770163 | Mold and method for encapsulation of electronic device | Teng Hock Kuah, Charles Vath, Loon Lim, Man Ho Hui, Juay Sim Koh | 2004-08-03 |
| 6752896 | Method of detaching a film of material from a substrate | See Yap Ong, Keng Hock Chew, Teng Hock Kuah | 2004-06-22 |
| 6736627 | Mold cleaning apparatus | Jie Liu, Zhen Rong Huang, Chin Guan Ong, Teng Hock Kuah | 2004-05-18 |
| 6709252 | Molding apparatus | Jie Liu, Si Liang Lu, Man Ho Hui, Teng Hock Kuah | 2004-03-23 |
| 6674165 | Mold for a semiconductor chip | Teng Hock Kuah, Si Liang Lu, Srikanth Narasimulau, Charles Vath | 2004-01-06 |