Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6830955 | Semiconductor package and method for manufacturing the same | WonSun Shin, DoSung Chun, Sangho Lee, Vincent DiCaprio | 2004-12-14 |
| 6762078 | Semiconductor package having semiconductor chip within central aperture of substrate | WonSun Shin, DoSung Chun, Sangho Lee, Vincent DiCaprio | 2004-07-13 |