DC

DoSung Chun

AT Amkor Technology: 2 patents #16 of 77Top 25%
📍 Chachoengsao, AZ: #1 of 2 inventorsTop 50%
Overall (2004): #30,043 of 270,089Top 15%
3
Patents 2004

Issued Patents 2004

Showing 1–3 of 3 patents

Patent #TitleCo-InventorsDate
6830955 Semiconductor package and method for manufacturing the same WonSun Shin, SeonGoo Lee, Sangho Lee, Vincent DiCaprio 2004-12-14
6797541 Leadless semiconductor product packaging apparatus having a window lid and method for packaging Sung Chul Chang 2004-09-28
6762078 Semiconductor package having semiconductor chip within central aperture of substrate WonSun Shin, Sangho Lee, SeonGoo Lee, Vincent DiCaprio 2004-07-13