Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6812570 | Organic packages having low tin solder connections | Mohammad Khan, Maria Guardado, Charles Anderson | 2004-11-02 |
| 6722553 | Controlled and programmed deposition of flux on a flip-chip die by spraying | Mohammad Khan, Maria Guardado, Ooi T. Ong | 2004-04-20 |
| 6709963 | Method and apparatus for jet printing a flux pattern selectively on flip-chip bumps | Jonathan D. Halderman | 2004-03-23 |