Issued Patents 2004
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6812570 | Organic packages having low tin solder connections | Raj N. Master, Maria Guardado, Charles Anderson | 2004-11-02 |
| 6722553 | Controlled and programmed deposition of flux on a flip-chip die by spraying | Raj N. Master, Maria Guardado, Ooi T. Ong | 2004-04-20 |