Issued Patents 2004
Showing 1–11 of 11 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6790757 | Wire bonding method for copper interconnects in semiconductor devices | Sailesh Chittipeddi | 2004-09-14 |
| 6784478 | Junction capacitor structure and fabrication method therefor in a dual damascene process | Yifeng Winston Yan | 2004-08-31 |
| 6750145 | Method of eliminating agglomerate particles in a polishing slurry | Annette M. Crevasse, William Easter, John A. Maze, Frank Miceli | 2004-06-15 |
| 6730600 | Method of dry etching a semiconductor device in the absence of a plasma | Nace Layadi, Simon John Molloy, Isik C. Kizilyalli | 2004-05-04 |
| 6730601 | Methods for fabricating a metal-oxide-metal capacitor | Edward B. Harris, Yifeng Winston Yan | 2004-05-04 |
| 6727588 | Diffusion preventing barrier layer in integrated circuit inter-metal layer dielectrics | Mahjoub Ali Abdelgadir, Nace Layadi, Vivek Saxena, Pei H. Yih | 2004-04-27 |
| 6720604 | Capacitor for an integrated circuit | Larry Bruce Fritzinger, Nace Layadi, Pradip K. Roy | 2004-04-13 |
| 6720261 | Method and system for eliminating extrusions in semiconductor vias | Steven M. Anderson, Siddhartha Bhowmik, Joseph W. Buckfeller, Frank Minardi | 2004-04-13 |
| 6703712 | Microelectronic device layer deposited with multiple electrolytes | Daniele Gilkes, Minseok Oh | 2004-03-09 |
| 6699372 | Method of coil preparation for ionized metal plasma process and method of manufacturing integrated circuits | Siddhartha Bhowmik, Frank Minardi | 2004-03-02 |
| 6686662 | Semiconductor device barrier layer | Isaiah O. Oladeji, Seong Jin Koh | 2004-02-03 |