Issued Patents 2004
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6787456 | Wafer-level inter-connector formation method | Vaidyanathan Kripesh, Ranganathan Nagarajan | 2004-09-07 |
| 6717812 | Apparatus and method for fluid-based cooling of heat-generating devices | Damaruganath Pinjala, Vaidyanathan Kripesh, Hengyun Zhang, Ranganathan Nagarajan | 2004-04-06 |
| 6710438 | Enhanced chip scale package for wire bond dies | Yong Kee Yeo, Navas O.K. Khan | 2004-03-23 |