NK

Navas O.K. Khan

AP Advanced Microdevices Pvt: 1 patents #1 of 3Top 35%
AT Amkor Technology: 1 patents #32 of 77Top 45%
IM Institute Of Microelectronics: 1 patents #7 of 42Top 20%
SP St Assembly Test Services Pte: 1 patents #5 of 22Top 25%
📍 Singapore, SG: #211 of 744 inventorsTop 30%
Overall (2004): #147,894 of 270,089Top 55%
1
Patents 2004

Issued Patents 2004

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6710438 Enhanced chip scale package for wire bond dies Yong Kee Yeo, Mahadevan Iyer 2004-03-23