Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6667190 | Method for high layout density integrated circuit package substrate | Kwun-Yao Ho | 2003-12-23 |
| 6569712 | Structure of a ball-grid array package substrate and processes for producing thereof | Kwun-Yao Ho, Lin-Chou Tung, Jackie Fu | 2003-05-27 |