JF

Jackie Fu

VT Via Technologies: 1 patents #21 of 69Top 35%
📍 Baoshan, TW: #83 of 319 inventorsTop 30%
Overall (2003): #204,331 of 273,478Top 75%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6569712 Structure of a ball-grid array package substrate and processes for producing thereof Kwun-Yao Ho, Moriss Kung, Lin-Chou Tung 2003-05-27