Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6573173 | Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process | Brian G. Anthony, Abbas Guvenilir, Mohammed Rabiul Islam, Venkat R. Kolagunta, John Mendonca +2 more | 2003-06-03 |