Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6573173 | Method for forming a copper interconnect using a multi-platen chemical mechanical polishing (CMP) process | János Farkas, Brian G. Anthony, Abbas Guvenilir, Venkat R. Kolagunta, John Mendonca +2 more | 2003-06-03 |
| 6551919 | Method for forming a dual inlaid copper interconnect structure | Suresh Venkatesan, Bradley P. Smith | 2003-04-22 |