ML

Mirng-Ji Lii

IN Intel: 1 patents #759 of 2,151Top 40%
📍 Zhumaoya, AZ: #1 of 1 inventorsTop 100%
Overall (2003): #156,274 of 273,478Top 60%
1
Patents 2003

Issued Patents 2003

Showing 1–1 of 1 patents

Patent #TitleCo-InventorsDate
6600233 Integrated circuit package with surface mounted pins on an organic substrate Hwai-Peng Yeoh, Hamid Azimi, Amir Nur Rashid Wagiman 2003-07-29