Issued Patents 2003
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6600233 | Integrated circuit package with surface mounted pins on an organic substrate | Hwai-Peng Yeoh, Hamid Azimi, Mirng-Ji Lii | 2003-07-29 |
Showing 1–1 of 1 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6600233 | Integrated circuit package with surface mounted pins on an organic substrate | Hwai-Peng Yeoh, Hamid Azimi, Mirng-Ji Lii | 2003-07-29 |