Issued Patents 2003
Showing 1–3 of 3 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6572005 | Bump-joining method | Kazushi Higashi, Kenji Takahashi, Shinji Kanayama, Hiroshi Wada, Takafumi Tsujisawa | 2003-06-03 |
| 6544377 | Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components | Naoto Hosotani, Koichi Morita, Syunji Onobori, Kenichi Nishino | 2003-04-08 |
| 6506222 | Method and apparatus for mounting component | Takashi Shimizu, Shinji Kanayama, Kenji Takahashi, Kazushi Higashi, Satoshi Shida +1 more | 2003-01-14 |