Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6647616 | Bump bonding unit with tray storage and transport apparatuses | Nobuya Matsumura, Hiroyuki Kiyomura, Kenji Takahashi, Shinji Kanayama | 2003-11-18 |
| 6544377 | Heating and pressurizing apparatus for use in mounting electronic components, and apparatus and method for mounting electronic components | Shozo Minamitani, Naoto Hosotani, Koichi Morita, Syunji Onobori | 2003-04-08 |