Issued Patents 2003
Showing 1–7 of 7 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6666994 | Conductive adhesive and packaging structure using the same | Takashi Kitae, Yukihiro Ishimaru, Tsutomu Mitani, Tousaku Nishiyama | 2003-12-23 |
| 6620345 | Conductive adhesive agent, packaging structure, and method for manufacturing the same structure | Yukihiro Ishimaru, Takashi Kitae, Tsutomu Mitani, Tousaku Nishiyama | 2003-09-16 |
| 6569512 | Mounting structure for an electronic component and method for producing the same | Tsutomu Mitani, Minehiro Itagaki, Yoshihiro Bessho, Kazuo Eda | 2003-05-27 |
| 6524721 | Conductive adhesive and packaging structure using the same | Takashi Kitae, Yukihiro Ishimaru, Tsutomu Mitani, Tousaku Nishiyama | 2003-02-25 |
| 6521144 | Conductive adhesive and connection structure using the same | Takashi Kitae, Yukihiro Ishimaru, Tsutomu Mitani | 2003-02-18 |
| 6512183 | Electronic component mounted member and repair method thereof | Tsutomu Mitani, Yukihiro Ishimaru, Takashi Kitae, Yasuhiro Suzuki | 2003-01-28 |
| 6510059 | Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module | Tsutomu Mitani, Yukihiro Ishimaru, Takashi Kitae | 2003-01-21 |