Issued Patents 2003
Showing 1–6 of 6 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6666994 | Conductive adhesive and packaging structure using the same | Hiroaki Takezawa, Yukihiro Ishimaru, Tsutomu Mitani, Tousaku Nishiyama | 2003-12-23 |
| 6620345 | Conductive adhesive agent, packaging structure, and method for manufacturing the same structure | Hiroaki Takezawa, Yukihiro Ishimaru, Tsutomu Mitani, Tousaku Nishiyama | 2003-09-16 |
| 6524721 | Conductive adhesive and packaging structure using the same | Hiroaki Takezawa, Yukihiro Ishimaru, Tsutomu Mitani, Tousaku Nishiyama | 2003-02-25 |
| 6521144 | Conductive adhesive and connection structure using the same | Hiroaki Takezawa, Yukihiro Ishimaru, Tsutomu Mitani | 2003-02-18 |
| 6512183 | Electronic component mounted member and repair method thereof | Tsutomu Mitani, Hiroaki Takezawa, Yukihiro Ishimaru, Yasuhiro Suzuki | 2003-01-28 |
| 6510059 | Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module | Tsutomu Mitani, Yukihiro Ishimaru, Hiroaki Takezawa | 2003-01-21 |