Issued Patents 2003
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 6642610 | Wire bonding method and semiconductor package manufactured using the same | Young-Kuk Park, Jae Dong Kim | 2003-11-04 |
| 6630373 | Ground plane for exposed package | Jeffrey D. Punzalan, Hien Boon Tan, Zheng Zheng, Jae Hak Yee | 2003-10-07 |